AMTC Advanced Mask Technology Center GmbH & Co. KG | Dresden

Papers


	Being a leading-edge technology center for advanced photomasks, the AMTC´s main focus in on technological research and development within the photomask and semiconductor industry. The results of our R&D activities are published, amongst others, at international conferences. Below you find AMTC related research publications. All files are smaller than 1,0 MB unless stated differently. EMLC 2010 Mask Cleaning Process Evaluation and Modeling (1,3 MB) CD Forecasting in Resist by Means of Scatterometry SPIE 2010 Analysis and Characterization of Contamination in EUV Recticles EUV Lithography at the 22-nm Technology Node Experimental Study of Effect of Pellicle on Optical Proximity Fingerprint for 1.35 NA Immersion ArF Lithography © 2010 Society of Photo-Optical Instrumentation Engineers (SPIE) PMJ 2010 New Type of Haze Formation on Masks Fabricated with Mo-Si Blanks (1,2 MB) Haze Risk Reduced Mask Manufacturing Process © 2010 Photomasks Japan BACUS 2010 Using Principal Component Analysis for Photomask CD Signature Investigation How to Match Without Copying - An Approach for APSM Mask Process Matching Using Aerial Imaging Multi-Shaped E-Beam Technology for Mask Writing A Systematic Approach to the Determination of SRAF Capabilities in High End Mask Manufacturing (1,5 MB) Detecting Measurement Outliers - Remeasure Efficiently Improving Registration Measurement Capability by Defining a 2D Grid Standard Using Multiple Registration Measurement Tools CD Inspection by Nuflare NPI 6000 Tool © 2010 Society of Photo-Optical Instrumentation Engineers (SPIE) EMLC 2009 Particle Transport and Reattachment on a Mask Surface (1,8 MB) Increasing Inspection Equipment Productivity by utilizing Factory Automation SW on TerraScan 5XX Systems SPIE 2009 Multiple Layer CD Control Treatment © 2009 Society of Photo-Optical Instrumentation Engineers (SPIE) SEMICON Korea 2009 Winning the EUV Mask Challenge © 2009 SEMICON Korea EMLC 2008 CDO Budgeting EUV Blank Inspection (4,71 MB) Introduction of new database reflected tritone algorithm for application in mask production Wafer Based Mask Characterization for Double Patterning Lithography PMJ 2008 Influence of Mask Surface Processing on CD-SEM Imaging Registration Measurement Capability of Vistec LMS IPRO 4 Metrology of EUV Masks by EUV-Scatterometry and Finite Element Analysis (1,1 MB) Results of new CD detection capability on advanced reticles © 2008 Photomasks Japan BACUS 2008 World Wide Matching of Registration Metrology Tools of Various Generations Optical Mask Characterization by Surrogate Wafer Print (SWaP) Method Comparative scatterometric CD measurements on a MoSi photomask using different metrology tools Impact of MegaSonic process conditions on PRE and Sub-resolution assist feature damage Process Control of Chrome Dry Etching by Complete Characterization of the RF Power Delivery © 2008 Society of Photo-Optical Instrumentation Engineers (SPIE) BACUS 2007 CD-Signature evaluation Evaluation using Scatterometry Mask Characterization for Double Patterning Lithography Pellicle dimensions for high NA photomasks Use of Layout Automation and Design Based Metrology for Defect Test Mask Design and Verification (2,04 MB) Wafer Inspection as Alternative Approach to Mask Defect Qualification © 2007 Society of Photo-Optical Instrumentation Engineers (SPIE) EMLC 2007 An Empirical Approach Addressing the Transfer of Mask Placement Errors During Exposure Programmed Defects Study on masks for 45nm Immersion Lithography using the novel AIMS^TM 45- 193i Time Resolved Evolution of the Etch Bias SPIE 2007 Advanced Edge Roughness Measurement Application for Mask Metrology contamination inspection on critical layers CAD based Line/Space Mix-up Prevention for Reticle Metrology (1,03 MB) Golden Curve Method for OPC Signature Stability Control in high MEEF Applications Meeting overlay requirements for future technology nodes with in-die overlay metrology © 2007 Society of Photo-Optical Instrumentation Engineers (SPIE) PMJ 2007 Enhancing productivity and sensitivity in mask production via a Fast Integrated T+R pattern inspection and STARlight-2TM contamination inspection on critical layers Field results from a new die-to-database reticle inspection platform (2,35 MB) Matching of Different CD-Metrology Tools for Global CD Signature on Photomasks © 2007 Photomasks Japan BACUS 2006 Analysis of the Vistec LMS IPRO3 performance and accuracy enhancement techniques Image Degradation due to Phase Effects in Chromeless Phase Lithography Inspectability and printability of lines and spaces halftone masks for the advanced DRAM node Limitations of optical reticle inspection for 45nm node and beyond Single Pass Die to Database Tritone Reticle Inspection Capability © 2006 Society of Photo-Optical Instrumentation Engineers (SPIE) EUV Symposium 2006 Comparison of actinic and non-actinic inspectionof programmed defect masks (2,76 MB) Evaluation EUV scatterometry for CD characterization of EUV mask using riogrous FEM-simulation Variability of the EUV etch process MathMod 2006 Data Evaluation as Source For Modelling in Nano-Imaging © 2006 ARGESIM ASIM, Wien EMLC 2006 Mask Data Volume-Historical Perspective and Future Requirements Systematic investigation of CD metrology tool response to sidewall profile variation on a COG test mask (2,3 MB) SPIE 2006 193nm Immersion Photomask Image Placement in Exposure Tools Alternating PSM balancing characterization: A comparative study using AIMS and wafer print data An advanced study for defect disposition through 193nm aerial imaging Applicability of alternating phase shifting masks using polarized light Defect Printability Study using EUV Lithography Demonstration of Phase-Shift Masks for Extreme-Ultraviolet Lithography (2,58 MB) Influence of mask manufacturing process on printing behavior of angled line structures (2,89 MB) Line edge roughness on photo lithographic masks © 2006 Society of Photo-Optical Instrumentation Engineers (SPIE) PMJ 2006 Metrology Limits of Mask Process Development Pellicle induced Aberration and Apodization in Hyper NA Optical Lithography © 2006 Photomasks Japan Solid State Chemistry 2006 Challenges of the Mask Manufacturing Approaching Physical Limits BACUS 2005 Advanced Edge Roughness Measurement Application for Mask Metrology Approaching Zero Etch Bias at Cr Etch Process Comparative study of simulations and experiments for contact array patterns on attenuated phase shifting mask Detailed Characterization of Inspection Tools:Capabilities and Limitations of the KLA 576 Determination of mask layer stress by placement metrology (1,38 MB) EUVL Mask Manufacturing-Technologies and Results (1,78 MB) Investigation of Sulfate Free Clean Processes for Next Generation Lithography Mask Cleaning Strategies-Haze Elimination Mask Cleaning Strategies-Particle Elimination with Minimal Surface Damage The importance of being homogeneous-on the influence of illumination inhomogeneity on AIMS images © 2005 Society of Photo-Optical Instrumentation Engineers (SPIE) EMLC 2005 Amine Contamination Monitoring and Control At the Advanced Mask Technology Center Defect Printability and Inspectability of Halftone Masks for the 90nm and 70nm Node Endpoint Detection Development for 70-nm Technology Cr Etch Process Results of a round robin measurement on a new CD mask standard SPIE 2005 Defect Printability and Inspectability of Cr-less Phase-Shift Masks for the 70nm Node Determination of mask induced polarization effects occurring in Hyper NA immersion lithography Exploring the 65nm frontier of alternating phase shifting masks with a quartz dry etch chemistry Impact of EUV Mask Pattern Profile Shape on CD Measured by CD-SEM (1,45 MB) Investigation of Polarization Effects on new Mask Materials © 2005 Society of Photo-Optical Instrumentation Engineers (SPIE) PMJ 2005 Advanced in-situ dry cleaning and metrology process for next generation lithography Aerial image based mask defect detection in dense array structures Application of a wafer development process to mask making Determination of mask induced polarization effects on AltPSM mask structures Determination of mask induced polarization effects on chromeless phase-shifting mask structures EUV Mask Image Placement Management in Writing,Registration,and Exposure_Tools Evaluation of E-Beam Sensitive CARs for Advanced Mask Making (2,56 MB) Second Level Printing of Advanced Phase Shift Masks using DUV Laser Lithography Simulation of Quartz phase etch affect on performance of ArF chrome-less hard shifter for 65nm technology (1,95 MB) Status of EUVL mask development in Europe (1,30 MB) Study of Stress Birefringence for 193nm Immersion Photomasks © 2005 Photomasks Japan BACUS 2004 Comparative Study of Mask Architectures for EUV Lithography (1,03 MB) First photomask developer based on state of the art wafer processing (1,47 MB) Pellicle Choice for 193-nm Immersion Lithography Photomasks Phase Standard on Profilometer Metrology Standard 2004 SiO2 Buffer-Etch Processes with a TaN Absorber for EUV Mask Fabrication © 2004 Society of Photo-Optical Instrumentation Engineers (SPIE) EMLC 2004 Investigation of Cr Etch Chamber Seasoning Optimized Processes and Absorber-Stack Materials for EUV Masks SPIE 2004 Defect Inspection of Quartz-PSMs: Taking a Leap Forward © 2004 Society of Photo-Optical Instrumentation Engineers (SPIE) PMJ 2004 Mask R&D Activities at the Advanced Mask Technology Center © 2004 Photomasks Japan

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